Hi everyone,

For the inertial sensors, we usually need to perforate the suspended
structure to release the structure with wet etching process.
-But how to know if the holes are big or dense enough to release the structure
completely?

For example, in the SOIMUMPs process, the oxide layer is 1 microm, the
structure layer is about 25 micron, undercut is 1.8 micron per side by  HF
vapor etching,
-Does this mean that  the distance between edges of  two adjacent etched
holes must be less the 1.8*2 micron if i need  to release the structure
completely?

Thanks!