Yes Jason,

i need to realize passing holes in germanium wafers of thickness 500um. In
the case they are too thick, i can accept to reduce the thickness to
100-200 um

Thanks,
Andrea

> Hi Andrea,
> A CF4 dry etch removes thermally deposited (amorphous) Ge very quickly,
> but I seem to recall that you're after a through-hole via in a
> crystalline Ge substrate. So it's worth a try, but no guarantees.
>
> Jason Milne
>