A slow cooling ramp from 200°C, ~45 minutes, keeps the glass wafers from
breaking.  Is it possible to "over cook" OmniCoat?  After this baking, the
exposed coating is easily removed in TMAH or NanoRemoverPG.  However, buried
OmniCoat layer between SU8 and the wafer is not attacked by either solvent, so
the SU8 does not release as planned.

Don Friedrich
Research & Development
JDSU - Advanced Optical Technologies

2789 Northpoint Parkway, M.S. BF-1
Santa Rosa, CA 95407 USA
707-525-7258 (Voice)
don.friedrich@jdsu.com