Hi Srini,

I am not very sure about your problem. Are you going to etch down the
bulk silicon for the comb structure with a pattern mask? Or, you have
already get the comb structure but want to thinner it? If you are not
able to depositing ITO for the mask, you may try some metals such as,
Al, Cr.

Good luck!
Fei

2008/12/27, Prasanna Srinivasan :
> Dear all,
>
> I am trying to etch down bulk silicon up to 120 microns using DRIE. The
> substrate is a bonded Si-Glass wafer consisting of patterned comb structures
> on Silicon. I am experiencing etch lag on silicon due to microloading of
> plasma. I would like to know if there is anyway we can overcome this
> problem. I knew there were some works done earlier by depositing ITO on
> glass. However, I would like to explore other options if any since my wafers
> are already bonded. I would appreciate your suggestions in this regard
>
> --
> Thanks & Regards,
> Srini

Fei Wang
Postdoctoral researcher, Dr
MIC - Department of Micro and Nanotechnology
Technical University of Denmark (DTU)
Building 344, 1st floor, Room no. 130
DK-2800, Kgs. Lyngby
Denmark
Tel:  +45 4525 6311
Fax:  +45 4588 7762
Email: fei.wang@nanotech.dtu.dk
       http://www.nanotech.dtu.dk