I am having trouble depositing metal stack-ups using either Chrome or
Titanium as an adhesion layer.  There have been instance in which the layers
peeled of during DI cleaning and in other instance the layers on top of the
seed layer delaminated.  I am e-beam evaporating the films around 8 uTorr
and the seed layer thickness is around 50 nm with overall metal thickness
-including ahdesion layer - of 0.85 um.  Has anyone run into a problem like
this?  Can anyone suggest a solution?


EVELYN BENABE
Graduate Research Assistant
RF Microsystems Research Group
University of South Florida
4202 East Fowler Avenue
Tampa, FL 33620
Office: ENB 412
Office Phone: (813)-974-4851
Email: benabe@mail.usf.edu