Dear All,

I have a hard time to deposit Chromium (50nm) followed by Platinum
(100nm) using a e-beam evaporator. After lift-off (using 1165), some
areas of the metal layer will peel off and the rest part has very rough
surface. I note that during deposition of Pt, the temperatures is quite
high and I have to interrupt the deposition when the temperature reaches
90C and let the system cool down before depositing again. Any
suggestions will be appreciated.

Best regards

Yinyan