Dear Basar,

Do you cure the resist before the deposition? If not, the bubbles may be
formed due to the outgassing of the resist during the depostion.

Regards,

Kagan


basar bolukbas wrote:
> Hello,
>
> I am trying to deposite Ni-Au metal layers (500A-3500A) to PMMA-950K-A6 resist
but
> after every deposition, i observed some resist/metal peeling problem.
> This bubble like structures trigger the removing of the metal layers.
> Do you have any suggestion or solution about this problem?
>
> Thank you for your answers.