I have heard that for improved etch resistance 1813 resist should be
post-develop baked.  Does any one know the recommended post development bake
temperature and duration for 1813 resist?  I understand that both the
temperature and duration should be larger than that of the soft-bake.


EVELYN BENABE
Graduate Research Assistant
RF Microsystems Research Group
University of South Florida
4202 East Fowler Avenue
Tampa, FL 33620
Office: ENB 412
Office Phone: (813)-974-4851
Email: benabe@mail.usf.edu