We usually do our PEB at 120 degrees C for 20-30 min in an oven. If
you use a hot plate I assume that you should use other times.

/Mikael

On 7 feb 2009, at 16.47, Evelyn B wrote:

> I have heard that for improved etch resistance 1813 resist should be
> post-develop baked.  Does any one know the recommended post
> development bake
> temperature and duration for 1813 resist?  I understand that both the
> temperature and duration should be larger than that of the soft-bake.
>
>
> EVELYN BENABE
> Graduate Research Assistant
> RF Microsystems Research Group
> University of South Florida
> 4202 East Fowler Avenue
> Tampa, FL 33620
> Office: ENB 412
> Office Phone: (813)-974-4851
> Email: benabe@mail.usf.edu
> _______________________________________________
> Hosted by the MEMS and Nanotechnology Exchange, the country's leading
> provider of MEMS and Nanotechnology design and fabrication services.
> Visit us at http://www.mems-exchange.org
>
> Want to advertise to this community?  See http://www.memsnet.org
>
> To unsubscribe:
> http://mail.mems-exchange.org/mailman/listinfo/mems-talk