Hi,

If it's not possible with a wafer dicer or you don't have the right equipment,
you can always try to dice it with a glass cutter. For €25 you have a very good
cutter and they are available for different wafer thickness sizes.

It works fine after some practice. The only possible constraint with this method
is that you have to apply some pressure to your wafer with a small ruler. But in
the case of bad adhesion, you can cut the wafers before you apply those
layers...

Nicolas

-----Original Message-----
From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org] On
Behalf Of NIR PERNAT
Sent: zondag 8 februari 2009 15:59
To: 'mems-talk@memsnet.org'
Subject: [mems-talk] Dicing glass wafer

What will be the best way to dice glass wafer 500-800 micron thick and glass-
polymer-glass sandwich wafers with 1700-2000 micron thickness?

-Nir