There are several ways.

a) cut like glass but yield is very poor
b) diamond saw could be suncontracted
c) laser technique
d) High pressure water.

Regards
Henri

2009/2/8 Nicolas Vergauwe 

> Hi,
>
> If it's not possible with a wafer dicer or you don't have the right
> equipment, you can always try to dice it with a glass cutter. For €25 you
> have a very good cutter and they are available for different wafer thickness
> sizes.
>
> It works fine after some practice. The only possible constraint with this
> method is that you have to apply some pressure to your wafer with a small
> ruler. But in the case of bad adhesion, you can cut the wafers before you
> apply those layers...
>
> Nicolas
>