You can pattern the metal layer by either using a lift-off process or by
etching the metal.  Once you have patterns on your wafer you can either use:

1. A profilometer   ==> a stylus runs through the wafer and detects the
difference in height between areas with metal and areas without metal.  You
can search Dektak 150 or Alpha Step profilers to get more info on how they
work.

2. Ellipsometer  ==> uses the refractive properties of the substrate and
film to determine the film thickness.  You have to check if your
ellipsometer will determine the thickness of both absorbent and
non-absorbent substrates and determine if Si is asbosbent or not.

Hope this helps.

Evelyn


On Mon, Feb 9, 2009 at 11:15 AM, Javier Crespo
wrote:

> Dear All,
>
> I want to deposit a Titanium layer to a silicon wafer by sputtering. The
> layer is about 100nm, but I don't know how to measure it. Does anyone
> know how could I measure the Ti thickness?
>
> Thanks,
>
> Xabier