When bonding between Pyrex and Si, it is observed that pitting occurs
quickly on the SiC electrode surface against the glass surface, after a
couple of bonding. It is assumed this is due to sodium deposits formed
during bonding at 500V/450C. This is kind of surprising since pure SiC (not
silicon rich) should show excellent resistance to alkaline corrosion. My
questions are: 1. Does the SiC electrodes used in anodic bonding usually
have composition other than pure SiC to have high conductivity? 2. Are there
other materials that may be more resistant to alkaline corrosion, like
Inconel nickel alloys, that can be used as the electrode material in anodic
bonder?

Thanks,

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Junjun Wu
Twin Creeks Technologies
Phone: 408-759-1426
Fax: 408-986-9142