Hello everybody,

I'm building a piezo micro motor, and I'm looking for methods of bonding bulk
PZT to a stainless steel or silicon substrate.
These can then be lapped/ precision ground down to required thickness (30um
or so), giving much better propeties than thin or thick film PZTs, which we also
do here.
Does anybody have any experience of bonding wafers with gold-silicon (or
another type of) diffusion bonding, sputtering solder layers down or using a
sol-
gel intermediate layer.
Really, I'm looking for a way to avoid epoxy bonding (which could end up giving
a bond as thick as the PZT), so all ideas will be very much appreciated.

Thanking you in advance

Phil Rayner