Hi Thomas,

Plated nickel is used as a DRIE etchmask. 1.)Photolith 2.) Ni plate 10-20um
thick 3.) Strip resist 4.) Strip seed 5.) DRIE

Regards,
Dave

David Roberts (Wafer Plating Specialist)
Prodigy Surface Tech (408) 469-3203 cell
807 Aldo Ave., Suite 103
Santa Clara, CA 95054
Phone (408) 492-9390
FAX (408) 492-9391

-----Original Message-----
From: Thomas W Frisk [mailto:tfrisk@kth.se]
Sent: Tuesday, March 31, 2009 9:30 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Thick positive photoresist revisited

Dear All,

I need to pattern fairly large features (10s of micrometers) with a thick (?
5-10 µm) positive photoresist. It should withstand some fairly tough etching
(DRIE, through wafer, fast'n hot production machine). Last time I did such
(say 7 years ago) we used 5470 (or was it 5740?). I seem to remember this
was not working out so well.

Now, what is the name of the game today? On our shelves I've found SPR 220
4.5 and AZ 4533. Could these be useful? And heard of AZ 9060 something....
Or should I get something even newer?

All opinions welcome, such as ease of use, tedious protocol, weird baking
procedures, multi-exposure, PEB, developer issues or?

Brgds Thomas F
Post-doc