durusmail: mems-talk: Thick positive photoresist revisited
Thick positive photoresist revisited
2009-03-31
2009-03-31
2009-03-31
2009-04-02
2009-04-02
2009-04-02
Thick positive photoresist revisited
Xiaoguang Liu
2009-04-02
HI Dave

Do you have an issue with Ni contaminating the DRIE chamber? I've
worked in several university fabs and none of the staff members would
allow metal in the chamber.

Best
Leo

On Thu, Apr 2, 2009 at 12:00 PM, David Roberts
 wrote:
> Hi Thomas,
>
> Plated nickel is used as a DRIE etchmask. 1.)Photolith 2.) Ni plate 10-20um
> thick 3.) Strip resist 4.) Strip seed 5.) DRIE
>
> Regards,
> Dave

--
Xiaoguang "Leo" Liu
Birck Nanotechnology Center,
Purdue University,
1205 W.State Street, West Lafayette, IN, 47906 USA
liu79@purdue.edu
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