Hey TJ,

If you are not overexposing your wafer to silane, silane should not be
sticking to your PDMS. So you might want to look into your silanization
protocol (I use dessicator chamber for 1-2 hrs, but for more accurate
deposition you might want to use a more sophisticated monolayer deposition
systems). Otherwise you might consider washing your PDMS slab with IPA and
water prior to bonding. Also, when trying to bond PDMS to PDMS, I have seen
that after bonding, the bonding strength increases if heated to about 60
degree celsius, and then kept overnight.

Hope this helps

--
Debkishore Mitra
Graduate Student
Bioengineering
UCB-UCSF JGGB
University of California, Berkeley and San Francisco
USA


>
> ---------- Forwarded message ----------
> From: 김태진 
> To: 
> Date: Fri, 10 Apr 2009 02:26:49 +0900
> Subject: [mems-talk] Problem with oxygen plasma bonding of two pdms slabs
> Hi all!
>
> I've been trying to bond two pdms devices using an oxygen plasma source.
>
> It seems that the plasma system can effectively bond two untreated pdms
> slabs, but the problem is...
>
> I have to coat my patterned wafer with silane as it has small pit/trench
> features.
>
> After slicing up my pdms slabs, I immediately tried bonding these two slabs
> together but without success.
>
> The plasma system has no problem in bonding two untreated pdms slabs, so I
> anticipate that the silane has rendered the pdms hydrophobic, leading to a
> failure in bonding.
>
> Is there a way to remove the silane coated pdms, after peeling it off from
> my wafer, to enhance the bonding strength?
>
> Thank you!
>
> Best,
>
> TJ