Hi,

For the bubbles, using a microscope we can see something like bubbles in
the resist used for the lift-off process.

Yes you are right, by "etching the resist", I was thinking of lift-off
the silane layer.

The silane is injected at 80 °C during about 3h (I am mot sure),  but
befor injection, a dehydratation is done at 100 °C under vacuum.

Thank you for this first answer.

Regards,

Alexandre

Warren Dustin a écrit :
> Hello Alexandre,
>
> Would you mind describing a little more of what you mean by a bubble
> formed?  Where was the bubble, in the coating?  How are you trying to
> etch the resist?  I assume when you say that you are trying to etch the
> resist you are trying to just remove the resist and lift off the Si
> layer you deposited?  Is the silane injected at an elevated temperature?
>
> Thanks, but need some more information to help fix the problem.
>
> Best Regards,
> Dustin Warren

--
Dr. Alexandre BOE
Post-doctoral researcher
Université Catholique de Louvain
FSA/ELEC/EMIC - Laboratoire d'hyperfréquences
Bâtiment Maxwell b.207
Place du Levant, 3
B-1348 Louvain-la-Neuve
Belgium
alexandre.boe@uclouvain.be
Tel.  +32 10 478 106
Fax   +32 10 478 705