Rob,

15 nm is good but you should be able to find a wafer supplier easily that can
give you a bit better (10 -?12 nm) than that after polishing. 60/40 scr/dig was
typically ok but being away from that type of work and given the mucher higher
device densities these days 40/20 or even 20/10 would not be surprising.

Good luck

Jim




-----Original Message-----
From: Mehmet Aykol 
To: General MEMS discussion 
Sent: Tue, 28 Apr 2009 5:03 pm
Subject: Re: [mems-talk] scratch and dig specs for anodic bonding


I remember a number 15nm as the average roughness for the limit but I might
be wrong. I am sure you can google it and find enough resources about it.
Also if you are using Pyrex from wafer companies like university wafer or
any other company they usually stock only polished Pyrex wafers.

Mehmet