Rob

Any Pyrex from a good supplier will do. 40/60 is good enough.  The bond
quality in anodic boning lies in the surface preparation and the bonding
process.

The scratch and dig specs are relevant only if your seal width is narrower
than a visible scratch and a dig diameter which is unlikely.

Shay

-----Original Message-----
From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org]
On Behalf Of Robert MacDonald
Sent: Tuesday, April 28, 2009 10:29 PM
To: mems-talk@memsnet.org
Subject: [mems-talk] scratch and dig specs for anodic bonding

Does anyone have standard specifications for pyrex wafer surface finish to
achieve a good hermetic anodic bond to Si (assuming good conditions).

In particular, I'm looking for a scratch and dig spec, or a surface
roughness specification.

Thanks,

Rob MacDonald