hi, I am making a MEMS device, that involves cascading two samples on
top of each other, and connecting them electrically. So I have been
looking into making conductive SU-8, patterning and using it as vertical
interconnects. Does someone here have experience with this?? any
suggestions will be appreciated.

I am looking at a couple of papers about mixing polyaniline and
protonation using HCl,which is a proprietary technique of IBM. Also, I cannot
have more than 2
microns spacing between the two samples, so I have to go with SU-8 2002,
not thicker.

is there any other way of forming 2 micron thin vertical interconnects between
two sandwiched wafers??

regards

Vaibhav Mathur
Photonics Center
University of Massachusetts,Lowell