Hello,

I am looking for a solution to make metallised vias (approx. 100 µm in
diameter) through a 500 µm thick 4-inch ceramic wafer.

The surface must then be planarized to be used in subsequent MEMS-processing
steps. So, it must be a kind of  a PCB on ceramics.

Does anybody know a vendor or maybe a process for that.

I would also be greatful in any information on how to efficiently create
such vias in silicon.

Thanks in advance!

Regards,
--
Denis