We used Laser to drill vias through ceramics. Screen printing processe
was used to fill the vias with metal paste and high temperature bake
was followed to solid the metal paste. Finally, polishing was done to
flat the surface.

On Wed, May 6, 2009 at 7:46 AM, Denis Petrov  wrote:
> Hello,
>
> I am looking for a solution to make metallised vias (approx. 100 µm in
> diameter) through a 500 µm thick 4-inch ceramic wafer.
>
> The surface must then be planarized to be used in subsequent MEMS-processing
> steps. So, it must be a kind of  a PCB on ceramics.
>
> Does anybody know a vendor or maybe a process for that.
>
> I would also be greatful in any information on how to efficiently create
> such vias in silicon.
>
> Thanks in advance!