Hello,

I am using BOSCH process for deep dry etching of silicon. The gases are SF6, O2
during etching cycles and C4F8 during deposition cycles.. At present I am
getting slightly negative sidewall, but I want a positive sidewall. Can you
please provide any hint, probably changing gas ratio (incerase or decrease any
of the gas content) or power to get a positive sidewall in etching. Any
suggestions will be greatly helpful for me. Thanking you in advance.

Best regards,
Shimul