Hi

The thickness of your metal layer can also be a problem for
wirebonding. It is more difficult to bond to a very thin layer of
gold. Try increasing the thickness of the Ti and Au.

Best
Leo

On Sat, Jun 20, 2009 at 2:14 PM, Alex Mellnik wrote:
> Hi Mikas,
>
> We have had similar problems with adhesion between Ti, Au and other
> materials that works well for liftoff, but generally does not survive
> wirebonding.  What other materials do you have in your e-beam system?  I'm
> surprised that the Ti did not work, but aluminum or chrome might also be
> worth a shot.  Finally, is the substrate treated any after the oxygen
> plasma?  A mild acid etch, if possible, might work.
>
> -Alex

Xiaoguang "Leo" Liu
Birck Nanotechnology Center,
Purdue University,
1205 W.State Street, West Lafayette, IN, 47906 USA
liu79@purdue.edu