Never tried it myself, but this reference:

Vlachopoulou et al. A low temperature surface modification assisted
method for bonding plastic substrates. Journal of Micromechanics and
Microengineering (2009) vol. 19 (1) pp. 015007

Seems like it should work.  Once you skip past the bonding to PMMA
then they do mention the likelihood of bonding to SU-8.  Worth a quick
try.

Good luck.

Matt

Dr Matt Davies
Post-doctoral Research Fellow
Science & Technology Research Institute
University of Hertfordshire
College Lane
HATFIELD        AL10 9AB
UK

e : m.davies@herts.ac.uk
t : +44 (0) 1707 28 61 74
f : +44 (0) 1707 28 1306

On 23 Jun 2009, at 17:00, mems-talk-request@memsnet.org wrote:

>
> From: 김태진 
> Date: 22 June 2009 17:58:26 BST
> To: "mems-talk@memsnet.org" 
> Subject: [mems-talk] bonding su-8 layer with pdms?
> Reply-To: General MEMS discussion 
>
>
> Hi all!
>
> Has anyone tried bonding a Su-8 layered substrate with PDMS?
>
> I made a attempts by treating a su-8 film coated wafer with pdms
> using oxygen plasma (30W for 1 min), but the devices seemed not bond
> at all.
>
> Does anyone have suggestions?
>
> Thanks!
> Best regards,
>
> TJ
>