Dear All,

I have metal patterns (Cr-Au and Platinum) in channels formed in
silicon/silicon dioxide. I would like to bond this with a Pyrex wafer.
Can you please suggest if anodic bonding of the patterned
silicon/silicon dioxide and pyrex would be the best method to bond or
I need to follow some other process for bonding. I am a bit doubtful
of the implications of high voltage and temperature used for anodic
bonding on the metal patterns.

Any help in this regard would be highly appreciated.

Regards,
Nidhi