It depends what the contaminant is.  A common problem with a vacuum
process such as metallization is restoring the pressure after
metallization causes gas vortexes which stir up the particles that are
on the floor of the metallization tool.  We found it imperative to
control the velocity of the incoming gas during the return to pressure.

Bill Moffat.

-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org] On Behalf Of Nicolas Vergauwe
Sent: Thursday, July 09, 2009 1:08 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Glass wafer cleaning with aluminium layer

Hi everyone,

During the processing of glass wafers with a layer of aluminum, I saw
the presence of dust and other contaminants on the wafer. Up to now, I
don't do any kind of cleaning after I sputtered the aluminum on the
glass wafer because I'm afraid this will affect the aluminum layer.

Can you recommend me a cleaning method which removes the contaminations
without harming the aluminum layer? Or are there other tricks to avoid
contamination?

Regards,
Nicolas