U can use

AZ4562 and spin it at

6000rpm for 30 sec that you give u about 5µm but before that u can spin on HMCTS
at 4250rpm for 25sec.....This will be fine on silicon surfaces....if you brebake
it well; 100°C/1min hotplate and 100°C/abt 10min in oven.....i dont know if u r
using hotplate or oven....

But you cannot use these adhesion promoters on Alu for example....with alu you
only have to coat the resist.....so the surface in question is also a
factor...not all surfaces need adhesive promoters...

U can also try TI prime instead of HMCTS but you have to bake TI prime before
coating the resist.

i hope this helps


--- On Sat, 7/18/09, Andrea Mazzolari  wrote:

From: Andrea Mazzolari 
Subject: [mems-talk] improve photoresist adhesion
To: "General MEMS discussion" 
Date: Saturday, July 18, 2009, 1:48 PM

Hi All,

I need to deposit a photoresist of thickness about 5um, and pattern it in
order to relize structures of lateral sizes 4x1000um. I tried using AZ9260
photoresist, but i had adhesion problems after development step.
I used HMDS as adhesion promoter.

I also tried to use a O2 plasma before photoresist spinning, but it did
not helped.

Any suggestions to improve photoresist adhesion ?

Best regards,
Andrea