Dear All,

We are seeing on our sputtered Ti/Au suddenly a random walk defect. I am
presuming it is somehow stress related, however changing pressure,
thickness, power, scan rate , substrate type, substrate cleaning,
masking glass panel edges all have no effect on it. The system is an MRC
system if that helps.

Thanks in advance
Mike

Dr Michael Cooke
Electronic Device Process Scientist

PETEC (The Plastic Electronics Technology Centre)
part of the CPI Group (Centre for Process Innovation)

NETPark,
Thomas Wright Way,
Sedgefield,
County Durham TS21 3FG

T:  +44 (0) 1740 625 717 (office)/+44 (0)1642 442 480 (lab)
F: +44 (0)1642 447 298

www.ukpetec.com 
www.uk-cpi.com