Hi, Yingtao,

    If you make AZ structure at about 120C, it will melt and reflow, it is a
well known phenomenon and people use this to make microlens and other
microstructures. Bake at below 100C should be fine.   But I dont really think
you will need to dry your patterned sample. hope this helps


Shao

--- On Wed, 8/12/09, Y.Tian  wrote:


From: Y.Tian 
Subject: [mems-talk] Post-bake of AZ photoresit
To: "General MEMS discussion" 
Date: Wednesday, August 12, 2009, 5:29 AM


Hi All,

Would anybody comment the post-bake of developed AZ photoresist? I just found
that the structure swells when I tried to post-bake the sample. Because I am
worrying that the AZ will adsorb moisture from the air and the sample was
prepared weeks ago, I just tried to dry it. Through the thickness direction, it
looks the sidewall is curved when the heat travel through it, which was
straight.

Anybody has experience about this?

Thanks a lot!

Regards,
Yingtao