Hi all, I am also trying to find a good way to do wafer bonding with thick layer like 60um. Is that possible for SU-8 or BCB? Thanks a lot! 2009/8/13, Kuijpers, Peter: > Hello, > > You can use Dry etch BCB (3000-serie. > Inhere we use it for W2W bonding. > > Regards, > > Peter Kuijpers -- Best regards, Yours sincerely Fei Wang ______________ Postdoctoral researcher, Dr MIC - Department of Micro and Nanotechnology Technical University of Denmark (DTU) Building 344, 1st floor, Room no. 130 DK-2800, Kgs. Lyngby Denmark Tel: +45 4525 6311 Fax: +45 4588 7762 Email: fei.wang@nanotech.dtu.dk http://www.nanotech.dtu.dk