Hi,

I have been working with LiNbO3 and HMDS. Two things we found important: The
LiNbO3 surface has to be as water-free as possible, which meant that we
dried the LiNbO3 despite its pyroelectrical properties under elevated
temperatures. Try to keep the temperature ramp low (2-4 deg C/min), this
should prevent too much charge built-up. Secondly, a short gentle soft-bake
of the resist.

Best regards
Holger
--
Dr. Holger Becker
microfluidic ChipShop GmbH
Carl-Zeiss-Promenade 10
D-07745 Jena
Germany
Tel. .+49 (0) 36 41 347 05 80
Fax: +49 (0) 36 41 347 05 90

Geschäftsführerin: Dr. Claudia Gärtner
Sitz der Gesellschaft: D-07745 Jena, Germany
Amtsgericht Jena: HRB 209251
USt.-IdNr.: DE 221812444




-----Ursprüngliche Nachricht-----
Von: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org] Im
Auftrag von Andrew Sarangan
Gesendet: Freitag, 14. August 2009 05:39
An: General MEMS discussion
Betreff: [mems-talk] Adhesion promoter for LiNbO3?

I am having adhesion problems of photoresist on LiNbO3 substrate. I've tried
HMDS (vapor prime) but it is not clear to me if HMDS works on LiNbO3.
Furthermore, my problem is exacerbated by the fact that I am not doing any
soft-bake or PEB, in order to avoid charge build-up on the substrate.
Instead I've been drying the resist films in a vacuum at room temperature.
This is Shipley 955 resist. Any thoughts would be appreciated.
Thanks.