Hi, I'm doing a nanoimprint lithography process where I've been using a soft mold (embossed Surlyn) and NXR-2010 photoresist (25nm) with several underlayers namely, TI-Prime, NXR-3022, and PMMA. I crosslink the resist with UV then try to remove the soft mold; the resist seems to get ripped off on most occasions. As far as I know, Surlyn can't be silanized which would prevent the resist from sticking to it. Can anyone suggest a way of getting better adhesion between the underlayer and resist? or a treatment for Surlyn. Thanks.