Lin,

You should look into the works done by MESA Research Institute, University
of Twente, The Netherlands,
http://www.fibrotools.com/articles-and-reviews.html, article #5. They
successfully implemented direct electroplating on highly doped Si by a
simple modification of a commecial plating tool.

Igor Kadija

----- Original Message -----
From: "lin yu" 
To: "General MEMS discussion" 
Sent: Tuesday, October 13, 2009 3:20 PM
Subject: [mems-talk] Electroplating question


> Hi,
>
> I'm working on a process which prevents me using a metal seed layer.
> So we considered using low-resistivity Si substrate as the conducting
> layer for metal electroplating. I was wondering if anyone has done this
> before? What's the risk of this process?
>
> Thanks,
> Lin