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Hi everybody,

     Does it have any probelms if we deposite the metal(gold) on the =
poly1=20
 without depositing poly2 using MCNC MUMPS?=20

    Recently, we had some MEMS dies back for testing. But if the design
 deposited the metal on the poly1 without poly2 (i.e. poly1+via+gold =20
 NOT poly1+via+poly2+gold) , the design seems to stick the wafer.=20
 And after pushing  it with probe, the structure will fail..... Does =
anyone=20
 knows what the problem is ? Thank you!!!
=20


Sincerely,
----------------------------------
Yu-Chen Lin
Electrical and Control Engineering
National Chiao-Tung University,Taiwan
u8612519@cc.nctu.edu.tw

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Hi everybody,
 
     Does it have any probelms =
if we=20
deposite the metal(gold) on the poly1 
 without depositing poly2 =
using MCNC=20
MUMPS? 
 
    Recently, we had =
some MEMS=20
dies back for testing. But if the design
 deposited the metal on=20
the poly1 without poly2 (i.e. poly1+via+gold  
 NOT poly1+via+poly2+gold) , the=20
design seems to stick the wafer. 
 And after pushing  =
it with=20
probe, the structure will fail..... Does anyone 
 knows what the problem is ? Thank =
you!!!
 
 
 
Sincerely,
----------------------------------
Yu-Chen=20
Lin
Electrical and Control Engineering
National Chiao-Tung=20
University,Taiwan
u8612519@cc.nctu.edu.tw


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