Hi Everybody,

Does anyone have experience with dicing hard cured polyimide layer (PI2525, HD
Microsystems)? I have a silicon wafer covered by a 100um thickness hard cured
PI2525 layer. I have to cut the polyimide layer into 5mm*5mm pieces by my dicing
saw. I'm wondering which kind of blade I should choose and what is the proper
spindle speed of the saw?

Thanks in advance.
Jianqiang Gu
Oklahoma State Univ.