Dear all,

After cutting silicon wafer with laser (frequency-tripled Nd:YAG-laser with wave
length 355nm) I observe that the silicon surface turned quite rough around the
cutting edge (height up to ~1µm, width ~ 50µm). Do you know some trick to avoid
or remove this surface roughening so that the surface quality is good enough for
silicon fusion bonding after laser cutting?

Thank you!

Cheers

Natsuki