With features that small, you may be better off laser cutting the parts.
Dicing through the silicon tends to affect the optical characteristics
of the part especially areas closer to the saw.

Regards,
Dave Lewis


-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org] On Behalf Of jianqiang gu
Sent: Tuesday, November 03, 2009 2:15 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Dicing Polyimide Layer

Hi Everybody,

Does anyone have experience with dicing hard cured polyimide layer
(PI2525, HD Microsystems)? I have a silicon wafer covered by a 100um
thickness hard cured PI2525 layer. I have to cut the polyimide layer
into 5mm*5mm pieces by my dicing saw. I'm wondering which kind of blade
I should choose and what is the proper spindle speed of the saw?

Thanks in advance.
Jianqiang Gu
Oklahoma State Univ.