I have a process to create tall (40-50 microns) pillar of AZ9260. After
development (AZ400k, 1:2 dilution), I notice a residual film present on
the wafer. The film is not present in areas where EBR was done (with
acetone).

The film can be removed by using a fine brush in the developer bath.
This method is not desired and the surface is not clean even if the
visible part of the film is gone.

Can someone suggest a treatment to remove this film and not damage the
copper pattern I have on my wafer?


Regards,
Sebastian Soisn