if you have a wafer dipper you can calculate the etch rate.

On Sun, Dec 20, 2009 at 2:24 PM, Andrea Mazzolari wrote:

> Hi all,
>
> i need to realize silicon memabranes of thickness 29um. I can not start
> from SOI wafers, cos the membrane will remain under stress state due to
> the oxide in the frame.
>
> I plan to realize the job by KOH etching, but how to precisely control the
> membrane thickness ? Is there any suggestion ?
>
> Thanks,
> Andrea

--
Nathan McCorkle
Rochester Institute of Technology
College of Science, Biotechnology/Bioinformatics