You could use a back grinding or dicing tape that is UV released or a spray on coating that will wash off in water. Regards, Steven J. Adamson Market Manager, Asymtek IMAPS Foundation Supporting the next generation -----Original Message----- From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org] On Behalf Of dan eliran Sent: Thursday, January 07, 2010 4:12 AM To: mems-talk@memsnet.org Subject: [mems-talk] Wafer surface protection UV tape for dicing Dear Mems-talk members, I'm looking for a protection tape to be use while dicing, in order to protect the top side of the device. This tape must peel spontaneously after dicing and UV irrading, possibly by heat. Does anyone use this tape or know a vendor of this tape? Dan