Charleston, I have successfully etched about 100 µm GaAs/AlGaAs with an ICP tool. We used a thick photoresist mask (10 µm or so) and it worked because of the backside cooling of the wafer in the ICP and the selectivity was about 15:1. Still, it took over an hour to etch with an etch rate under 2 µm/min. 1 mm is 10x more etching, and I'm not sure it can be done strictly with DRIE. The chemistry used is typically Cl based (either Cl2 or BCl3), and your tool and facility needs to be set up to handle the hazardous gases. This type of etch tends to form nasty byproducts that contaminate the chamber and the vacuum systems, so additional maintenance is required. Good luck, Brad Cantos brad.cantos@holage.com http://holage.com On Jan 11, 2010, at 8:18 AM, Charleston LEE wrote: > I have one more question. If the etch depth is 1mm, what's the DRIE recipe of GaAs? And what mask should be used? > > Thanks very much! > > LEE