Hi Andrea

If you bake the resist after development then it would definitely be
harder to get straight side walls, from my experience. I would suggest
having a look at the unbaked resisit profile and seeing what angle it
has.

If you need to use the resist for an etch or any other process where
you need a certain selectivity you can even use thicker resists that
might give you straight walls and you might not have to bake after
development.

Regrads
Nipun Sinha

On Sunday, January 17, 2010, Andrea Mazzolari  wrote:
> Hi Prasanna,
> PR thickness is about 2 um.
>
> May you give me the recipe you used to obtain vertical sidewalls in S1813
> ? I think it could be a good starting point for me.
>
> Thanks.
> Andrea
>

Nipun Sinha
PhD Candidate
Penn Micro and Nano Systems Lab
Mechanical Engineering and Applied Mechanics
University of Pennsylvania, Philadelphia, USA
Webpage: http://www.seas.upenn.edu/~nipun/