Hi All,

I'm building a MEMS device that uses PR as a sacrificial material. The final
stage of processing mounts the wafer on a polyvinyl chloride (PVC) type
expandable dicing tape. As some PR is left behind, i need a method (dry or
wet) to strip the remaining PR without destroying the polyvinyl chloride
(PVC) dicing tape.

Has anyone come across this problem before? Does anyone have a suggested
approach?

Note:
1) Expandable dicing tapes (PVC) cannot withstand high temperatures (e.g. O2
ashing above 40°C etc).
2) Expandable dicing tapes (PVC) are not compatible with many sovents (e.g.
NMP, Acetone, Ethanol etc).

Kind regards,
Andrew