Hello Anirban,

you can check AZ 9260 data sheet
http://www.az-em.com/pdfs/9200/az_9260_photoresist.pdf there is 24 um
process well described. From my experience, if you use mask aligner exposure
check if you are in good contact to have good structures profile. Important
thing is to let the resist re-hydrate after soft bake for some time and also
use spray development to develop the patterns.

If you have any particular problem with process let us know.

Best regards,

Daniel Figura
smartfabgroup
process consulting - data processing - fab software
Phone: +44 20 3286 4342
E-mail: daniel.figura@smartfabgroup.com, Web: www.smartfabgroup.com

-----Original Message-----
From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org]
On Behalf Of ANIRBAN SARKAR
Sent: Friday, February 05, 2010 7:41 AM
To: General MEMS discussion
Subject: [mems-talk] AZ 9260 processing

Hi all,

I need some suggestions for the following fabrication objective:

Using AZ 9260 positive resist, I would like to achieve thickness for ~ 20 um
and the smallest feature size is 10um.

I am facing some problems in the soft bake, exposure dose and development of
the patterns.

I would be obliged if I can get some recipe that I could use as a reference.

Thanking you in anticipation,

Anirban