Hi, all,

I diced a 4-in silicon wafer into 15mm*15mm pieces. I usually use cotton
tips soaked with acetone to clean the small wafer pieces.
However, it is very time consuming when I deal with a large amount of
pieces. Also, I find the surface could not be cleaned thoroughly sometimes.
There are still some residue and tiny particles staying on the surface.

Do you have any suggestion on how I am supposed to improve the cleaned surface
quality in an efficient way?

Very appreciative!

Li