Hi Li,

We bake our samples on a hot plate for 5 min at 110 deg C. after the
USB clean.  Then we let it cool for about 2 min. before we spin on the
PR.

Tony

On Tue, Mar 9, 2010 at 9:33 PM, Li. Zhang  wrote:
> Hi Tony,
>
> Thanks for your suggestion. It is very helpful and I'm gonna try on it.
> I have one more small question. Do you bake the wafer piece after USB in
> methanol or you just directly spin adhesion promoter or PR after this step?
>
> Thanks,
>
> Li. Zhang

--
Tony Price
Department of Electrical Engineering
University of South Florida
4202 E. Fowler Avenue, ENB-118,
Tampa, FL, 33620
Office: ENB 412
Phone: (813) 974-4851
Cell: (404) 291-3506