Using a cover tape could protect your openings during the dicing procedure.


Dear Natsuki,

you can use a cover tape on the glass wafer for protecting the openings
during the dicing procedure. Of course, delaminating the cover tape after
the dicing is challenging but it is possible by using an additional removing
tape.

Have a look at this website:
http://www.nitto.com/product/datasheet/semicon/002/index.html.

We have used this approach successfully for the dicing of chips with
microchannels.

Regards,

Thorsten Knoll
Fraunhofer Institute Biomedical Engineering
Microsensors & Microfluidics
Ensheimer Str. 48
66386 St. Ingbert
GERMANY

Phone   +49-(0)6894/980-350
Fax       +49-(0)6894/980-152
thorsten.knoll@ibmt.fraunhofer.de
www.ibmt.fraunhofer.de