Hi,

We are looking for a metallization which will be used for ohmic contact to
polysilicon and will also be compatible with soldering and wire bonding.

Correctly, we are using Aluminum which cannot be soldered. we tested Al/Ni/Au
but interdifusion during annealing (400C) prevented successful soldering.

We also tested Cr/NiCu/Au but the short annealing step required for ohmic
contact also prevent good solderability.

Does anyone has any suggestions for metallization which could be used for ohmic
contact to polysilicon and is also compatible with soldering and wire bonding?

Thank you,
Meni Kabla